As 5G router products involve extensive signal and data transmission during operation, ensuring timely transmission becomes crucial. The use of low dielectric thermal pads can reduce latency during the signal transmission process.

SEANTEC's low oil-bleeding, low volatility thermal conductive silicone film is specifically designed for applications requiring minimal oil penetration. Compared to standard thermal conductive silicone films, it exhibits reduced oil-bleeding under continuous pressure.

In order to solve the problem of heat dissipation, the rear shell is generally made of metal material and a large area of heat dissipation hole is designed, and then the thermal conductive interface material is used between the heating element and the back shell to reduce the contact thermal resistance between the heating element and the radiator and improve the heat dissipation effect.

Phase-change materials, on the other hand, remain in a solid state at room temperature and only melt when reaching specific temperatures, providing stable protection for electronic devices operating at temperatures as high as 125°C. Additionally, some phase-change material formulations can achieve electrical insulation functionality. Moreover, when phase-change materials revert to a solid state below the phase-change temperature, they can avoid being extruded, resulting in better stability throughout the device's lifespan.

SEANTEC's thermal interface materials offer excellent thermal conductivity, helping industrial robot controller manufacturers maintain stable surface temperatures under high loads. These materials also exhibit high-temperature resistance, corrosion resistance, and oxidation resistance, ensuring the robot's long-term performance and reliability. Additionally, their ease of processing and installation shortens production cycles and reduces manufacturing costs.

SEANTEC Electronics offers thermal interface materials with excellent thermal conductivity and stability, which meet the requirements of automotive electronics.

To ensure sufficient contact and heat transfer between the aforementioned heat load and the inner walls of the metallic casing, a thermal management material is needed. This material should not only provide excellent thermal conductivity but also possess electrical insulation properties to fill the air gaps between the device and the heat sink's uneven surfaces. Products such as thermal conductive gel, potting compound, and thermal pads offer reliable environmental performance, good workability, and different levels of thermal conductivity to meet various customer requirements.

Smart wearable devices belong to the realm of consumer electronics and have requirements for lightweight and slim designs. The NS1000 series of absorptive materials can be used to address interference issues in RF, BT, and WiFi frequency bands. Additionally, shielding materials such as conductive fabric, copper foil tape, FIP conductive adhesive, and conductive foam can be used to address electromagnetic interference problems.

The increasing demand for AI high-performance computing drives the evolution of data transmission rates towards 400G, 800G, and beyond.