GOF1000 thermal gasket, provides thermal transfer performance in the form of a traditional wrapped compressible foam gasket. GOF1000 combines the thermal transfer performance of the Tgon™ 9000 synthetic graphite outside wrap and the repeatable compression and rebound of a foam core. GOF1000 utilizes a polyurethane foam. 

EcoTemp Series FoF gaskets are composed of metallized fabric wrapped around a soft nonurethane foam core. They are supplied with either a non-conductive or electrically conductive Pressure Sensitive Adhesive (PSA), and can be equipped with an Extended Release Liner (ERL) on the adhesive. The EcoTemp gasket is a halogen-free product that can be created with square and rectangular cross-sectional profiles. The EcoTemp gaskets can be further customized to an application by die-cutting, hole punching, notching, etc.

Tflex™ HD80000 is the latest product in the High Deflection gap filler series.Tflex™ HD80000 combines 6 W/mK thermal conductivity with superior pressure versus deflection characteristics. The combination will allow minimal stress oncomponents while also yielding low thermal resistance. As a result, lessmechanical and thermal stresses will be experienced within your device.

Tflex™ HR600 is a cost-effective and compliant gap filler thermal interface material with excellent thermal performance and great handling for mass-production applications.

Tflex™ UT20000 is a specially formulated ultra-thin gap filler thermal interface material designed for thin interfaces that offers excellent thermal performance and high compliancy. It is designed without embedded reinforcing fiberglass to minimize contact resistance, yet still allows easy material handling and durability during assembly.