With the rapid development of electronic technology and the increasing demands of users for product performance and comfort, smart wearable devices have become increasingly complex and powerful. In order to enhance the data processing capabilities and achieve low-latency signals in wearable devices, high-performance data processing chips must be used, which also generate relatively high heat.

Smart wearable devices require lower manufacturing costs and the development and production of lightweight, energy-efficient, and powerful devices. Additionally, due to the proximity of these devices to the human body, there are stricter requirements for factors such as electromagnetic radiation, especially with regard to surface temperature, as it can affect the comfort of use.

Currently, most thermal conductive materials prioritize high thermal conductivity. However, since wearable devices strive for aesthetic appearance, small size, and light weight, thermal conductive materials with high thermal conductivity and low density are more suitable for smart wearable devices. The use of low-density thermal gels in smart wearable devices helps reduce the overall weight of the device and improves wearing comfort.

Smart wearable devices belong to the realm of consumer electronics and have requirements for lightweight and slim designs. The NS1000 series of absorptive materials can be used to address interference issues in RF, BT, and WiFi frequency bands. Additionally, shielding materials such as conductive fabric, copper foil tape, FIP conductive adhesive, and conductive foam can be used to address electromagnetic interference problems.