The increasing demand for AI high-performance computing drives the evolution of data transmission rates towards 400G, 800G, and beyond. Optical modules, as electronic devices that enable optoelectronic and electro-optical conversion in optical signal transmission, find applications in scenarios such as base stations, switches, optical fiber routers, and transceivers. As traffic ports, the growing number and speed of ports impose higher requirements on optical modules.

Optical modules are evolving towards miniaturization, low power consumption, hot-plug capability, high-speed transmission, long distances, and intelligence. Data centers and telecommunications operators have increasingly higher requirements for the transmission rates of optical modules. The skyrocketing transmission rates and capacities inevitably lead to increased heat generation in the equipment. Consequently, the heat dissipation requirements for optical modules also become more stringent. Additionally, due to the complex electromagnetic environment in which optical modules operate, the need to avoid electromagnetic interference is crucial.

In product design, on one hand, it is important to ensure fast heat transfer. The improvement of optoelectronic device performance increases the heat dissipation power, and if heat cannot be transferred promptly, it can reduce the lifespan of the device and lead to product failure. On the other hand, while preventing electromagnetic interference, it is necessary to ensure signal transmission quality.

In the application solutions for optical modules, commonly used heat interface materials include thermal pads, thermal greases, and phase change materials. These materials ensure the rapid dissipation of heat from electronic components. When using thermal greases, it is important to ensure a smooth and oil-free surface. EMI materials commonly used include FIP conductive adhesives, conductive foam, and absorbing materials. FIP conductive adhesives are typically applied at the edge of the housing, and absorbing materials are mainly used in TOSA, ROSA, bases, gold fingers, PCB boards, etc., to absorb energy. Conductive foam is applied at the optical interface to provide elasticity and certain anti-electromagnetic interference functionality.

For high-power optical modules that require faster heat dissipation due to higher transmission speeds, additional heat dissipation design solutions such as VC thermal plates or heat pipes can be applied to the housing.