The increasing demand for computational power and bandwidth in data centers has led to a significant rise in energy consumption. High temperatures pose a major threat to the performance and reliability of electronic systems, as higher temperatures result in increased power consumption and decreased system performance. Therefore, controlling the temperature of server systems and related electronic equipment is crucial for uninterrupted data storage and processing.

Currently, data center servers and networking products primarily employ air cooling and liquid cooling methods for heat dissipation. In practical tests, the CPU is the main heat-dissipating component of servers. Apart from air and liquid cooling, choosing appropriate thermal interface materials can assist in heat dissipation and reduce overall thermal resistance in the heat management process.

For thermal interface materials, the importance of high thermal conductivity is self-evident. The main purpose of using heat dissipation solutions is to reduce thermal resistance and enable rapid heat transfer from the processor to the heat sink.

Among thermal interface materials, thermal grease and phase-change materials have better gap-filling capabilities (interface wetting ability) compared to thermal pads. This enables the achievement of very thin bonding layers, thereby providing lower thermal resistance. However, thermal grease is prone to displacement or extrusion over time, leading to loss of fillers and resulting in decreased heat dissipation stability.

Phase-change materials (TPCM7000/5000), on the other hand, remain in a solid state at room temperature and only melt when reaching specific temperatures, providing stable protection for electronic devices operating at temperatures as high as 125°C. Additionally, some phase-change material formulations can achieve electrical insulation functionality. Moreover, when phase-change materials revert to a solid state below the phase-change temperature, they can avoid being extruded, resulting in better stability throughout the device's lifespan.