As electronic devices move towards high integration and miniaturization, their heat generation has been increasing rapidly. Miniaturized electronic components often possess higher power densities. When these devices are in operation, they generate heat, which can lead to overheating, performance degradation, or even device damage.

In the process of electronic device design and manufacturing, the importance of thermal management cannot be underestimated. To ensure device reliability and long-term performance, effective solutions for electronic device overheating are imperative. Thermally conductive silicone films, due to their flexibility, good interface adhesion, low thermal resistance, and high thermal conductivity, have become essential materials for thermal interfaces.

Thermally conductive silicone films are typically manufactured using silicon oil and thermally conductive powders. Since silicon oil contains small silicon-oxygen (siloxane) molecules, these molecules can precipitate and adsorb onto the surfaces of electronic components under prolonged heat and pressure conditions. This phenomenon affects the operational lifespan and safety performance of electronic components, and it also leads to contamination of electronic devices. Therefore, controlling the oil-bleeding rate of thermally conductive silicone films within a reasonable range is essential.

SEANTEC's low oil-bleeding, low volatile thermally conductive silicone film is specifically designed for applications requiring low oil permeation. Compared to regular thermally conductive silicone films, it exhibits reduced oil bleeding under continuous pressure. The low volatile series is manufactured using special equipment and processes, resulting in extremely low small molecule volatility, excellent thermal conductivity, high compressibility, super flexibility, and high resilience. Additionally, it boasts good insulation properties, making it highly suitable for scenarios such as security equipment, projection systems, automotive electronics, lenses, and laser devices, where limitations on small molecule volatility are crucial.