requests from different ports to different networks, so larger data processing capabilities are usually required.

Switches play an important role in network construction. They work uninterrupted for a long time and require good heat dissipation. ASIC/FPGA chipsets and complex cell designs require high-performance materials to address thermal conductivity and electromagnetic interference issues to ensure reliable data processing capabilities.

The heat dissipation system uses thermal pads (Tflex300, HD700), thermal grease (Tgrease series), and heat pipe radiators. The heat generated by the chip is transferred up and down through the thermal conductive material to minimize the temperature difference between the interfaces and achieve rapid transfer. heat, so as to effectively control the temperature of the whole machine within the design range.

The rapid development of electronic information technology has brought about an efficient and convenient life, but the electromagnetic radiation generated by it has brought increasingly serious problems and has become another new source of pollution that threatens health. We can use absorbing materials, power and signal line inductors, FIP conductive adhesive, conductive rubber (ECE), etc. to solve the electromagnetic interference problem of electronic equipment in a timely and effective manner.